Products
Advanced Materials for Electronics and Automotive
Description
Features:
- High speed dispensing
- Fast cure with reflow oven
- Good protection for IC and electronics components
- Clear COB good for visual inspection
- High Tg & Low stress
- Low shrinkage during cure
- Good structural epoxy with no flow
- Encapsulation of PLCC/SMD packages
- Excellent UV resistance
- Good weatherability
- High thermal conductivity
- Good Heat resistance
- Electronics – Chip On Board Expoxy, SMT Epoxy, Die Attach, Epoxy Potting, Silicon Potting, UV Epoxy, Acrylic Conformal Coat
- Thermal Management – Silicon Pad, Non-Silicon Gap Filler, Thermal Stick, Epoxy Adhesive, Silicone Adhesive
- Photonics – Heat Curable Fiber Optic Epoxy, Dual Cure UV Fiber Optic Adhesive, Casting Epoxy, High Brightness LED Epoxy & Silicone, SMD/PLCC Epoxy & Silicone, Potting Epoxy
- Composites – Structural Epoxy
For more info, please directly contact
CT Yeo
Email:
ctyeo.cts@ese.com.sg
Phone: (65) 6276 3328
