Description
Features:
• High speed dispensing
• Fast cure with reflow oven
• Good protection for IC and electronics components
• Clear COB good for visual inspection
• High Tg & Low stress
• Low shrinkage during cure
• Good structural epoxy with no flow
• Encapsulation of PLCC/SMD packages
• Excellent UV resistance
• Good weatherability
• High thermal conductivity
• Good Heat resistance